Deep Silicon Etching for X-Ray Diffraction Devices Fabrication
Abstract
We report deep reactive ion etching of silicon gratings via cryogenic and Bosch processes. An aspect ratio of > 50 is achieved for 400 nm period gratings with both processes. [ view full abstract ]
Authors
- Houxun Miao (NIH)
- Mona Mirzaeimoghri (University of Maryland, College Park/NIH)
- Lei Chen (NIST CNST)
- Han Wen (NIH)
Topic Areas
Biomedical optical devices and nano-biophotonics , Nanofabrication, packaging and integration
Session
Mo-3 » Systems and applications (15:30 - Monday, 14th August, Sierra/Cumbre/Vista)
