Electromagnetic Coupling Mechanisms in Vertically Oriented Metallic Plasmonic Inclusions
Abstract
The ability to orient metallic plasmonic inclusions vertically enables orientation-dependent coupling arrangements which cannot be achieved in conventional planar engineered materials. In this paper we discuss these coupling... [ view full abstract ]
Authors
- Bruce Burckel (Sandia National Laboratories)
Topic Areas
Metamaterials and metasurfaces, passive and tunable , Nanofabrication, packaging and integration
Session
Tu-2I » INVITED: Plasmonic devices (10:30 - Tuesday, 15th August, Sierra/Cumbre/Vista)
Paper
Electromagnetic_Coupling_Mechanisms_in_Vertically_Oriented_Metallic_Plasmonic_Inclusions_v1.pdf
