Scaling of Integrated Photonic Packaging for Volume Manufacture

Abstract

Existing technical challenges make packaging of Photonic Integrated Circuits (PICs) difficult to scale to high volumes. Significant challenges remain in areas such as efficient optical fiber coupling, light source and... [ view full abstract ]

Authors

  1. Peter O'Brien (Tyndall National Institute, University College Cork)

Topic Area

Packaging and Integration

Session

INV-3 » Invited: Prof. Peter O'Brien - Scaling of Integrated Photonic Packaging for Volume Manufacture (16:30 - Monday, 30th July, Forum Rolex)