Scaling of Integrated Photonic Packaging for Volume Manufacture

Existing technical challenges make packaging of Photonic Integrated Circuits (PICs) difficult to scale to high volumes. Significant challenges remain in areas such as efficient optical fiber coupling, light source and... [ view full abstract ]

Existing technical challenges make packaging of Photonic Integrated Circuits (PICs) difficult to scale to high volumes. Significant challenges remain in areas such as efficient optical fiber coupling, light source and electronic device integration and thermal management. This paper will present some of the outstanding packaging challenges for PICs and what is being done to address them. In particular, details about the new European PIC Packaging Pilot Line will be presented. This includes development of standard photonic packaging building block,design rules and a novel approach to make available a wide range of advanced packaging technologies capable of scaling to high volumes.