Room-temperature wafer bonding using smooth Au thin films for integrated plasmonic devices
Abstract
Room-temperature wafer bonding of 4-inch Si wafers with a few tens of nanometers thick Au films using Ar plasma surface activation was demonstrated for integrated plasmonic devices. Thermal stability of Cr/Au multilayer thin... [ view full abstract ]
Authors
- Michitaka Yamamoto (National Institute of Advanced Industrial Science and Technology (AIST)/The University of Tokyo)
- Takashi Matsumae (National Institute of Advanced Industrial Science and Technology (AIST))
- Yuichi Kurashima (National Institute of Advanced Industrial Science and Technology (AIST))
- Hideki Takagi (National Institute of Advanced Industrial Science and Technology (AIST))
- Tadatomo Suga (The University of Tokyo)
- Toshihiro Itoh (The University of Tokyo)
- Eiji Higurashi (National Institute of Advanced Industrial Science and Technology (AIST)/The University of Tokyo)
Topic Area
Packaging and Integration
Session
MO-POS » Poster Session: Nanophotonics (Including Standing Dinner & Drinks) (18:00 - Monday, 30th July, Forum Rolex)
